Manufacturing Services

Kadled EMS

Electronic Manufacturing Services

We install components on printed circuit boards with SMT (Surface Mount Technology) and PTH technology (Pin Through Hole).
We have an automated SMT line with a capacity of 48,000 components per hour and dimensions from 0.4 mm x 0.2 mm to 200 mm x 110 mm and a production line with qualified personnel for manual welding and assembly manual assembly PTH.

our experiences

Why customers choose us

0
3D Printing prototypes
0
x 1000 Components per hour
0
% Qualified personnel
0
X Visual inspection microscope
Kadled EMS

Surface Mount Technology

Our Services

  • SMT (Surface Mount Technology).
  • PTH (Pin Through Hole).
  • Postcards with high mix and low volume.
  • Prototypes of electronic cards.
  • Electronic design oriented manufacturing.
  • New Product Development.
  • Industrialization postcards.
  • Electrical tests using an Agilent ICT.
  • Programming Component.
  • Mechanical assemblies.
  • PCB autoloader, 500 mm high storage.
  • Printer solder paste automatic DEK Horizon 03iX.
  • Three Siplace pick and place machines ASM with great versatility.

 

Iluminación LED, Servicio de Ensamble Electrónico, EMS, ahorro consumo energético, LED lighting, Electronic Manufacturing Services, EMS, Energy Saving
An overview

QUALITY CONTROLS

Our main processes

Delivery rigorous inspection in the warehouse area to verify the raw material according to the specific product guidelines listed in ERP software.

The air in the area of automatic mounting (SMT) is free from dust is filtered then through a HEPA filter U15.

The raw material is prepared for each product, according to the particular specifications of each production order and bill of materials in Epicor ERP.

Humidity and temperature monitoring in the area of automatic assembly, ensuring that they count on the optimal operating conditions.

Handling, packing, labeling, storage, shipping and use of moisture reflow sensitive surface components according to the regulations IPC/JEDEC J-STD-033.

Storage and inventory control is governed by a strict FIFO (First In, First Out) control and batch controlled by the ERP system.

TwinHead, more performance in less space

Pick and Place TH Siplace-Siemens

Technical specifications

COMPONENT RANGE 0402 at SO, PLCC, QFP, BGA, special components
MAXIMUM HEIGHT 25 mm
MINIMUM PITCH 0.15 mm
MINIMUM DIMENSION 1 mm x 0.5 mm
MAXIMUM DIMENSION 50 mm x 50 mm a 200 mm x 110 mm
MAXIMUM WEIGHT 100 g
FORCE R. - FRAY 1 N – 15 N - 30 trays
Accuracy, flexibility, quality and speed in each project.

Pick and Place CP 20 Siplace-Siemens

Technical specifications

COMPONENT RANGE 01005 to 2220, Melf, SOT, SOD
MAXIMUM HEIGH 4 mm
MINIMUM PITCH 0.25 mm
MINIMUM DIMENSION 0.4 mm x 0.2 mm
MAXIMUM DIMENSION 6 mm x 6 mm
MAXIMUM WEIGHT 1 g
FORCE RANGE 1.5 N – 4.5 N
More options for your electronics productions.

Pick and Place CPP Siplace-Siemens

Technical specifications

COMPONENT RANGE 01005 at 27 mm x 27 mm
MAXIMUM HEIGHT 8.5 mm
MINIMUM PITCH 0.3 mm
MINIMUM WIDTH 0.15 mm
MIN AND MAX DIMENSION 0.4  x .02 mm - 27 x 27 mm
MAXIMUM WEIGHT 4 g
FORCE RANGE 1 N – 10 N
Dual lane conveyor, for all your high throughput needs.

Vitronics Soltec XPM3i 820

Technical specifications

HEAT ZONES 8
COOLING ZONES 2
HEATED LENGTH 104 In
COOLING LENGTH 26 In
TOTAL LENGTH 186.75 In
MAXIMUN TEMPERATURE 360° C

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